ÍæÅ¼½ã½ã

Return to ÍæÅ¼½ã½ã Advance

The semiconductor industry is poised for extraordinary growth in the years to come, and innovation is at the core of it. Innovation requires collaboration across industry partners. 

Ideas are only as good as their impact, and ultimately, our customer collaborations are about turning constellations of ideas into new technologies customers can use to drive their products forward.?Events like SPIE Advanced Lithography + Patterning create an amazing forum for the industry to come together to share challenges and breakthroughs ¨C and brainstorm ideas that drive innovation.  

ÍæÅ¼½ã½ã's Ahmad Khan at SPIE
By Ahmad Khan,
president, Semiconductor Process Control
ÍæÅ¼½ã½ã's Ahmad Khan interacts with attendees of the annual SPIE Advanced Lithography + Patterning conference.

The SPIE 2024 event was held late in February, where EUV production implementation and high numerical aperture (NA) EUV readiness were among the key themes. We also had broad discussions on innovations like new front-end architectures and advancements in packaging technology. 

Technical presentations at these events create common ground for discussions that often result in solutions for some of the most complex problems facing our industry.

Many interactions highlighted the critical role metrology, inspection and process control plays in driving industry roadmaps. In fact, the process control section was the largest conference at the symposium. 

ÍæÅ¼½ã½ã employees and several customers shared almost 30 papers across a range of topics such as software solutions, metrology and advanced packaging. (Links to several abstracts are included below.)

¡°Our engagements with peers and colleagues at events like SPIE Advanced Lithography + Patterning can spark new ways of thinking and improve on ideas that move us forward. I interacted with multiple customers at ÍæÅ¼½ã½ã Interconnect ¨C the industry event we host at SPIE.¡±

Ahmad Khan

Below is a sampling of abstracts ÍæÅ¼½ã½ã leaders shared at SPIE Advanced Lithography + Patterning in 2024.? 

SPIE Advanced Lithography + Patterning conference attendees.
  • Houssam Chouaib, ÍæÅ¼½ã½ã Milpitas, California, ; proposes a methodology that uses a physical model assisted machine learning (ML) algorithm applied to the Mueller Matrix elements of spectroscopy ellipsometry to measure low-sensitivity CDs for inline monitoring of gate all around nanosheet transistor devices? 
  • Donghwan Son, ÍæÅ¼½ã½ã Milpitas, California: ; shows how measured SEM and AFM images are processed to fit with rendered reference SEM and AFM images and how advanced scanner simulation models can determine wafer printability of mask absorber defects, buried defects and absorber residues? 
  • Vinayak Pandey, ÍæÅ¼½ã½ã Arizona, ¡±; discusses new process control solutions being developed for advanced 3D packaging? 

Subscribe to receive
News from ÍæÅ¼½ã½ã

Blog Subscribe
Data Transfer *
Marketing *

Are you sure?

You've selected to view this site translated by Google Translate.
ÍæÅ¼½ã½ã China has the same content with improved translations.

Would you like to visit ÍæÅ¼½ã½ã China instead?


ÄúÒÑÑ¡Ôñ²é¿´ÓɳҴǴDzµ±ô±ð·­Òë·­ÒëµÄ´ËÍøÕ¾¡£
°­³¢´¡ÖйúµÄÄÚÈÝÓëÓ¢ÎÄÍøÕ¾Ïàͬ²¢¸Ä½øÁË·­Òë¡£

ÄãÏë·ÃÎʰ­³¢´¡ÖйúÂð£¿

If you are a current ÍæÅ¼½ã½ã Employee, please apply through the ÍæÅ¼½ã½ã Intranet on My Access.

Exit