{"id":251,"count":4,"description":"Íæż½ã½ã offers a range of plasma etch and deposition process technologies for advanced packaging schemes - from High Density Fan-Out Wafer-Level Packaging (FOWLP) to the most advanced 3D packages where two or more die, potentially for different functions, are stacked and connected in the vertical direction with through-silicon vias (TSV) filled with metal. Leveraging decades of expertise in silicon etching, Íæż½ã½ã also offers the most advanced plasma dicing solutions for dicing before grind (DBG) or dicing after grind (DAG) of wafers up to 300mm in diameter.\r\n\r\nOur production-proven processes and precise process control allow chip manufacturers to lower production costs and improve reliability, performance and multi-function integration.","link":"https:\/\/www.kla.com\/products\/packaging-manufacturing\/wafer-processing-systems-for-advanced-packaging","name":"Wafer Processing Systems for Advanced Packaging","slug":"wafer-processing-systems-for-advanced-packaging","taxonomy":"product_cat","parent":154,"meta":[],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Wafer Processing Systems for Advanced Packaging | Íæż½ã½ã<\/title>\n<meta name=\"description\" content=\"SPTS Technologies provides plasma etch and deposition process solutions 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