{"id":656,"count":5,"description":"ÍæÅ¼½ã½ã\u2019s direct imaging (DI) for patterning systems enable manufacturers to produce advanced PCBs and IC substrates designed with exceedingly thin conductors and transmission lines. These copper traces must be formed with extreme precision as circuit density increases and the distance between lines becomes narrower. ÍæÅ¼½ã½ã\u2019s DI systems establish the required highly accurate and efficient patterning processes by achieving the best imaging results with the highest yield and throughput to support continued innovation for PCBs and IC substrates.","link":"https:\/\/www.kla.com\/products\/pcb-ic-substrate-manufacturing\/direct-imaging-patterning","name":"Direct Imaging for Patterning","slug":"direct-imaging-patterning","taxonomy":"product_cat","parent":655,"meta":[],"acf":[],"yoast_head":"\n