ÍæÅ¼½ã½ã

Skip to main content

Video: Advanced Packaging Webinar Series (Part I) – Low Temperature Dielectric Deposition for Advanced Packaging


In this webinar we demonstrate how high quality PECVD dielectric films can be deposited at temperatures as low as 100¡ãC while maintaining high film quality and stability. We then discuss the use of these films in a number of advanced packaging applications.

If you are a current ÍæÅ¼½ã½ã Employee, please apply through the ÍæÅ¼½ã½ã Intranet on My Access.

Exit