{"id":250,"count":2,"description":"Íæż½ã½ã's packaged component inspection and metrology systems characterize key features of advanced and traditional package types with varying size and interconnect styles. Our systems provide sensitivity to a variety of defect types, Al-driven smart binning of defects, and accurate and repeatable 3D metrology measurements, which together provide packaging manufacturers the data required to improve their yield while effectively sorting components so that defective parts are quickly removed. 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