{"id":660,"count":2,"description":"ÍæÅ¼½ã½ã's direct imaging (DI) solutions for solder mask (SM) deliver high-accuracy, high-quality imaging with production throughput for any solder mask design, from the simplest to the most complex. These high-capacity, field-proven solutions for mass production ensure consistently precise imaging quality with a low total cost of ownership for a wide variety of applications including high-density interconnects (HDI), multi-layer boards (MLB), and flexible printed circuit boards (FPCB), as well as specialized white solder mask applications like miniLED backlight unit-based products, either on PCB or glass substrates.","link":"https:\/\/www.kla.com\/products\/pcb-ic-substrate-manufacturing\/direct-imaging-solder-mask","name":"Direct Imaging for Solder Mask","slug":"direct-imaging-solder-mask","taxonomy":"product_cat","parent":655,"meta":[],"acf":[],"yoast_head":"\n