AI is a transformative technology. By enhancing efficiency, driving innovation and empowering data-driven decisions, AI is revolutionizing industry, science, creativity and experiences. Semiconductors are at the center of this AI revolution ¨C chip technology drives AI innovation and AI enables next-gen chip performance. As AI and semiconductor technologies progress in unison, they shape the future of AI, unlocking new opportunities and defining the future of our digital world.
Data centers utilize AI chips with high computational power capable of handling large models and data sets to support cloud-based AI applications, including large-scale training and deployment of AI models. Specialized chips, such as GPUs, AI accelerators, and HBMs, are designed to handle the unique demands of AI tasks in data centers.
Edge devices utilize high-performance, low power consumption chips, such as ASICs, FPGAs and NPUs, that process data locally at the network's edge. These chips accelerate AI applications that require real-time decision making, such as autonomous driving, cameras, IoT sensors, mobile phones and wearables.
AI chip complexity drives the need for more intensive process control during production and packaging. Íæż½ã½ã's differentiated inspection, review, metrology and software systems are indispensable for producing chips that meet the power, performance and efficiency requirements of AI.
Click on the numbers to learn more about the parts of an AI chip
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The GPU (graphical processing unit) serves a central role in AI chips, providing the processing power needed for AI model training and inference.
Íæż½ã½ã's process control solutions tackle GPU chip production challenges by:
HBM (high bandwidth memory) provides high capacity and high-speed communication with the AI processor, enabling efficient handling of data for AI model training and execution.
Íæż½ã½ã's process control and process-enabling solutions support production of the HBM stacked memory architecture by:
Advanced packaging technology combines the GPU and HBM components into a single AI chip package for optimal performance. The interposer and IC substrate provide the power and connections needed for communication and data transfer among the various chips. The final packaging also serves as a protective enclosure for the chips.
Íæż½ã½ã's process control and process-enabling solutions support multi-die heterogenous integration and final component quality by:
AI and high-performance compute technologies enable next-level performance for our portfolio of differentiated inspection, review, metrology and software systems. Our products use AI to produce actionable data that accelerates production of the chips that power the next-generation of AI innovation.
Our portfolio of defect inspection systems capture and identify defects on wafers, reticles, packages, IC substrates and PCBs, reducing the time required to resolve production yield or reliability issues. Using integrated AI, these inspectors employ deep learning and machine learning to distinguish extremely subtle defect signals from surrounding pattern and process noise. With AI, our systems adapt to evolving inspection requirements, providing manufacturers with detailed insights into critical defects. This accelerates development, optimizes production and speeds time-to-market for innovative electronic devices.
Learn more about Íæż½ã½ã's AI-powered defect inspection systems.
Inspection systems capture critical defects for reticles, wafers, packages, IC substrates and PCBs. Reviewing optical and e-beam defect images has traditionally involved human intervention to verify defect types. Leveraged by our inspection, review and software systems, AI technology learns and adapts to quickly sort and classify defects with reduced errors and without slowing down production.
Metrology systems provide precise measurement of pattern dimensions, film thickness, pattern placement and alignment, surface topography and electro-optical properties. Our metrology systems leverage AI technology to enhance profile modeling and improve measurement accuracy and robustness. By identifying nanoscale variations, our AI-driven metrology helps manufacturers control process variability, leading to better device performance and higher yield.
AI connects the systems within our comprehensive product portfolio to push the boundaries of process control performance even further. Whether connecting a few systems or many different types of systems, our unique AI-driven analytics generate meaningful response prediction, dynamic sampling and optimized process control.
AI technology in smart manufacturing utilizes connected data to drive automated optimization. By processing massive data sets, AI systems provide insight into trends and production excursions and use this knowledge to make decisions. To maintain quality, yield and productivity, AI-generated visibility of the manufacturing process can provide the traceability required to drive continuous improvements.
Within Íæż½ã½ã's products, AI has shifted the workloads associated with image processing and data extraction to GPUs, enhancing the efficiency and performance of our image computers.
Our global Íæż½ã½ã Services organization leverages AI applications and technologies to drive faster time to solution for our customers.
From writing software code to everyday work tasks, AI helps automate and optimize processes, thereby increasing the efficiency and productivity of our global workforce.
Rick Wallace
President and Chief Executive Officer
On Feb. 18, President and CEO Rick Wallace sat down for an interview with CNBC's Jim Cramer to talk about the state of the semiconductor industry and Íæż½ã½ã's business.
Íæż½ã½ã is at the heart of AI transformation. Learn how we are empowering chipmakers with the precision and insight needed to keep pace with AI¡¯s accelerating demands.
Watch Now
IITM interviews Pradeep Ramachandran, Director and Head of Research, to discuss the Íæż½ã½ã's impact to the semiconductor industry leveraging AI
We take on complex technical challenges that often take years to solve. We work on the edges of deep science exploring electron and photon optics, sensors, artificial intelligence and data analytics. Our experts in physics modeling, AI, algorithms, software and compute hardware uncover solutions hidden in large data sets and scale our solutions to support discovery at the edge of the nanoverse.
Ann Arbor, Michigan, USA
At our AI and Modeling Center of Excellence based in Michigan, our global team of physicists, AI engineers, applications engineers and systems designers provide solutions for expanding AI's reach in Íæż½ã½ã's products and develop innovations that help solve critical challenges across the semiconductor ecosystem.
Íæż½ã½ã Careers in MichiganIIT Madras Research Park, Chennai, India
At our AI and Advanced Computing Lab (AI-ACL) based in India, our team of researchers, data scientists, AI engineers and high-performance computing (HPC) system designers collaborates to push the boundaries of AI, algorithms, software, image processing and parallel computing.
Íæż½ã½ã Careers in IndiaSemiconductor innovation thrives in advanced packaging. Our solutions help advance connectivity within tomorrow's high-performance chips.
Navigation, infotainment, driver assistance, autonomous driving, flying cars! Our solutions revolutionize quality control for the ICs that power the future of automotive.
The Internet of Things is expanding quickly, and the demand for smart devices is growing with it! Our solutions drive increasing production to match it.
5G is bringing higher data speeds and lower latency to the next generation of devices! Our solutions help ensure the necessary yield and reliability.
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